Share Your Expertise as a Panelist, Presenter, Session Developer or Other Subject Matter Expert
Abstract submissions for the 2024 FlexPack PLACE Conference, to be held April 15 – 17, 2024 in San Diego, CA, are due September 1, 2023. To be considered for presentation, abstracts must be submitted through TAPPI’s secure Speaker Management System (SMS). Acceptance notifications will be sent by September 15, 2023, with final papers due January 5, 2024. PowerPoint presentations will be due on or before February 9, 2024.
If you need help submitting your abstract into the system, please contact: Pat Stiede, Speaker Management, or by phone at 770-209-7214.
Suggested Topics
- Advances in Resin Technologies
- Advances in Bio-degradable and Bio-based Materials
- Advances in Specialty Films and Coatings
- Advances in Barrier and Package Performance Properties
- Advances in Material & Packaging Design
- Advances in Material & Packaging Structure Processing
- Advances in Extrusion Processing Equipment and Related
- Auxiliary Equipment
- Advances in Downstream Packaging Equipment
Are you a flexible packaging and extrusion professional or academic who has a case study, research paper or other timely topic that can be shared in panels, roundtables, or other sessions? Do you know of any professionals in the field interested in presenting on any of the topics below and would like to serve as a Session Developer? If so, please contact Ankush Gokhale, Program Chair, or Lisa Rushin, TAPPI Division Manager.