The Daniel Siegel Memorial Scholarship: Application deadline ended Saturday, February 15
Purpose: To encourage talented science and engineering students to pursue careers in the packaging industry and to develop awareness of the industry, and of the TAPPI International Flexible Packaging and Extrusion Division.
This $4,000 scholarship is presented in even-numbered years, and will be awarded to a TAPPI Student Chapter member enrolled in a packaging or related major. The scholarship is funded by an endowment from MICA Corporation and the Siegel family. The International Flexible Packaging and Extrusion Division of TAPPI serves the interests of the industries relating to Flexible Packaging and Extrusion. Industries pertaining to these technologies include packaging, industrial films and laminations, blown and cast films extrusion, extrusion coatings and laminations, sheet extrusion and printing associated with these areas.
Special requirements: Applicants must demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusion Division. To apply, use this link to access the tappi.org scholarship page where you can specifically select the Dan Siegel scholarship using the Survey Monkey application form. To do so, you can utilize an existing Survey Monkey account by clicking on the "Log In" tab at the top of the page, or if you don't have one, register for free using the "Register" button, also at the top of the page on the right side.
For more information, email Robert Dawson, IFPED Division Manager.